With the widespread adoption of electronic products, people's reliance on electronic devices has been increasing, and the frequency of updates and replacements is relatively high. This not only raises higher fashion requirements for the appearance of products but also demands higher quality.
Currently, whether it's rigid boards or flexible ones, whether it's resistors and capacitors or ICs, they all undergo encapsulation, under filling, adhesive reinforcement, and other adhesive operations to ensure product reliability. Especially for mobile phones, the level of dust and waterproofing is increasing, and the precision of adhesive placement is paramount. 3D laser guidance is not only used for graphical guidance but also for tracking the trajectory and shape of the entire dispensing, ensuring that every product produced achieves a 100% yield rate.
Axxon keeps pace with the progress and changes of the times. According to customer requirements, we design products that are more suitable for production, which has been recognized by the market and gained the trust of customers. We strive to provide better services and create more value for our customers.
Underfill
Underfill enhances the protection of electronic components and effectively improves resistance to thermal stress, vibration and shock.
Electronic Components / Pin Encapsulation
Electronic Components / Pin Encapsulation
SMA
Surface Mount Adhesive is a single-component epoxy resin adhesive stored at room temperature, which rapidly solidifies upon heating.
Corner Bonding
Reinforcing the bonding strength of large components such as BGAs or CSPs (Chip Scale Packages) is essential.
Chip Cooling
Excessive heat generated by high speed chips must be transferred heat sinks via thermal interface materials.
Solder Paste
Used in the SMT industry for soldering electronic components such as surface mount resistors, capacitors, and ICs onto PCBs.
Plasma Cleaning
PCB's and products are not always clean when they arrive to the production floor. Surface contaminants such as oxides or other contaminatns may be present that can reduce the adhesion or wetting of fluids. Surface treatment technology can eliminate these contaminants.