Glob top serves the purpose of protecting chips, solder joints, and bond wires.
Glob top enables encapsulation of PCBs after surface mounting and wire bonding, offering greater flexibility in design changes. The sealant used in Glob top serves as a protective material for chips and bond wires and is commonly employed in the Chip-On-Board (COB) packaging process on circuit boards. It provides protection against moisture, thermal shock, corrosion, bending, vibration, and physical or chemical damage caused by fatigue, serving as a protective barrier for chips, wire bonds, and surface-mounted products.
Process Characteristics
Glob top is primarily applied in the Chip-On-Board (COB) packaging process on circuit boards, serving to protect chips, bond wires, and top-sealed surface-mounted products.
During the Glob top dispensing process, key process factors include adhesive volume control, dispensing position, and valve parameter planning, ensuring integrity of the Glob top dispensing coverage, dispensing thickness, absence of dispense defects, and elimination of air bubbles.
As the application of COB packaging processes such as LED packaging and LCD screen module encapsulation becomes increasingly widespread, the requirements have correspondingly escalated. This necessitates higher precision in adhesive volume control, consistency in dispensing, and increased durability of dispensing systems.
Axxon's contact dispensing systems offer an ideal solution for achieving Glob top applications. Furthermore, Axxon possesses advanced precision screw feeding systems and mature, reliable products and solutions. In response to future demands, Axxon has increased research and development efforts, achieving significant breakthroughs in core technology areas such as closed-loop adhesive volume control systems and highly durable auger feeding systems.
Dispensing Performance
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